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제조능력

NO. 항목 일반기술능력 특수기술능력 사진첨부
1 표면처리 HASL,ENIG,TIN,OSP HASL,ENIG,TIN,OSP, Immersion Ag, Gold
2 보드 두께 공차 0.4mm - 3.2mm 0.3mm - 6mm
3 층수 1-10Layers 최대 48L까지 가능
4 내층 최소 간격

4L: 0.16mm

6-8L: 0.18mm

10L: 0.25mm

4L: 0.15mm

6-8L: 0.15mm

10L: 0.20mm

5 내층 최소 선폭 /선간격

1 oz: 0.1mm/0.1mm

2 oz: 0.15mm/0.15mm

3 oz: 0.20mm/0.25m

H oz: 0.1mm/0.075mm

1/3 oz: 0.075mm/0.075mm

4 oz: 0.25mm/0.30mm

5 oz: 0.35mm/0.38mm

6 oz: 0.40mm/0.45mm
6 외층 최소 선폭 /선간격

1 oz: 0.12mm/0.15mm

1.5 oz: 0.15mm/0.18mm

2 oz: 0.22mm/0.22mm

3 oz: 0.25mm/0.35mm

4 oz: 0.30mm/0.40mm

5 oz: 0.40mm/0.50mm

6 oz: 0.50mm/0.60mm
7 회로간격공차

간격≤80mm: ±0.10mm

간격≤120mm:±0.12mm

간격＞120mm: ±0.15mm

간격 ≤80mm: ±0.075mm

간격 ≤120mm: ±0.10mm

간격＞120mm: ±0.12mm
8 Impedance공차 ±10% ±7%
9 Min홀 직경 0.2mm

0.15mm
10 Max홀 직경 6.0mm

＞6.0mm（To CNC)
11 NPTH 공차 ±0.05mm

＞±0.0254mm
12 PTH공차 ±0.075mm

＞±0.05mm
13 PTH쓰루홀공차

Width tolerance : ±0.08mm

Length tolerance: ±0.08mm

Width tolerance: ±0.05mm

Length tolerance: ±0.05mm
14 NPTH쓰루홀공차

Width tolerance: ±0.025mm

Length tolerance: ±0.05mm

Width tolerance: ±0.025mm

Length tolerance: ±0.05mm
15 Countersink hole Depth Tol

Min. ±0.075mm

Min. ±0.05mm
16 홀간격 정밀도

Min. 0.30mm

Anti-CAF: ≥0.45mm

Min.0.25mm

Anti-CAF: ≥0.35mm
17 Hole Wall Spacing

10:1

12:1
18 S/M bridge 폭

Green/blue/red/yellow PSR: Min 0.07mm

Black PSR : 0.125mm White PSR: 0.15mm

Green/blue/red/yellow PSR: Min 0.07mm

Black PSR: 0.10mm White PSR: 0.125mm
19 Solder Mask Clearance Min. 0.05mm Min. 0.025mm
20 S/M covering line Min. 0.06mm Min. 0.05mm
21 S/M 두께

Conductor corner≥4μm

1차 인쇄 두께: 10-20μm 2차 인쇄 두께:20-30μm

기판 ≤ 동박두께 + S/M conductor thickness

Conductor corner≥4μm

1차 인쇄 두께: 10-20μm 2차 인쇄 두께:20-30μm

기판 ≤ 동박두께 + S/M conductor thickness
22 PSR 홀플러깅

0.2mm-0.5mm aspect≤8:1

0.15mm-0.55mm aspect≤10:1
23 레진 홀플러깅

PTH 0.2mm-0.6mm aspect≤15:1

Blind hole 0.2mm-0.5mm aspect≤2:1

PTH 0.15mm-1.0mm aspect≤20:1

Blind hole 0.2mm-0.5mm aspect≤2:1
24 Min legend width 0.08mm

0.08mm
25 Min legend height 0.71mm 0.71mm
26 Min legend area size 0.15mm 0.12mm
27 Min peelable mask thickness 0.30mm 0.30mm
28 Max peelable mask thickness 0.60mm 0.60mm
29 카본 1차 인쇄두께 10-20μm 10-20μm
30 카본 2차 인쇄두께 20-40μm 20-40μm
31 HASL 두께 1μm-40μm 1.5μm-30μm
32 니켈 두께 3-8μm 3-8μm
33 ENIG 두께 0.025μm-0.075μm 0.025μm-0.1μm
34 OSP 두께 0.2μm-0.55μm 0.2μm-0.35μm
35 TIN 두께 0.8μm-1.4μm 0.8μm-1.4μm
36 Ag 두께 0.15μm-0.40μm 0.15μm-0.40μm
37 금도금 두께 0.10μm-2.5μm 0.10μm-2.5μm
38 Punching Tol & Min Space between conductor and edge ±0.10mm

판두께＜1.0mm: 동노출부위:0.15mm ~ 0.25mm

판두께≥1.0mm: 동노출부위:0.15mm 동미노출부위: 0.30mm

 ±0.05mm

판두께＜1.0mm: 동노출부위:0.15mm~0.25mm

판두께≥1.0mm: 동노출부위:0.15mm 동미노출부위: 0.30mm
39 V-cut line to V-cut line Tol ±0.10mm ±0.075mm
40 V-cut Offset Tol ±0.1mm ±0.075mm
41 V-cut Angle 30°/45°/60° 30°/45°/60°
42 Jump v-cut ≥15mm ≥15mm
43 Bevelling depth tolerance ±0.1mm ±0.075mm
44 Bevelling angle 20°/30°/45°/60°15-45°(inside angle） 20°/30°/45°/60°15-45°(inside angle）
45 라우터 공차 ±0.13mm ±0.10mm